Low-cost silicon wafer dicing using a craft cutter

Published 2014 View Full Article

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Title
Low-cost silicon wafer dicing using a craft cutter
Authors
Keywords
Silicon Wafer, Transparency Film, Fabrication Cost, Alignment Process, Diamond Blade
Journal
MICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS
Volume 21, Issue 7, Pages 1411-1414
Publisher
Springer Nature
Online
2014-05-19
DOI
10.1007/s00542-014-2198-4
References
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