Laser cutting sandwich structure glass–silicon–glass wafer with laser induced thermal–crack propagation

Published 2017 View Full Article

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Title
Laser cutting sandwich structure glass–silicon–glass wafer with laser induced thermal–crack propagation
Authors
Keywords
Silicon-glass device, 1064, nm semiconductor laser, Laser induced thermal-crack propagation (LITP), J-integral, Crack propagation profile
Journal
OPTICS AND LASER TECHNOLOGY
Volume 93, Issue -, Pages 49-59
Publisher
Elsevier BV
Online
2017-02-24
DOI
10.1016/j.optlastec.2017.01.028

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