Dicing of Thin Silicon Wafers with Ultra-Short Pulsed Lasers in the Range from 200 fs up to 10 ps

Published 2015 View Full Article

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Title
Dicing of Thin Silicon Wafers with Ultra-Short Pulsed Lasers in the Range from 200 fs up to 10 ps
Authors
Keywords
-
Journal
Journal of Laser Micro Nanoengineering
Volume 10, Issue 2, Pages 229-233
Publisher
Japan Laser Processing Society
Online
2015-05-13
DOI
10.2961/jlmn.2015.02.0022

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