Microhole machining of silicon wafer in air and under deionized water by pulsed UV laser system

The research on mechanical effect etching Si in pulsed laser micromaching under water

(2010) Long Yuhong et al.   APPLIED SURFACE SCIENCE

Circular and rectangular via holes formed in SiC via using ArF based UV excimer laser

(2010) L. Liu et al.   APPLIED SURFACE SCIENCE

Systematic Optimisation of Process Parameters in Laser Drilling of 200 µm Photovoltaic Silicon Wafers Using New Kind of Nanosecond IR Lasers

(2010) Klaus-Peter Stolberg   Journal of Laser Micro Nanoengineering

Effect of Shot Number on Femtosecond Laser Drilling of Silicon

(2010) P. Laakso   Journal of Laser Micro Nanoengineering

Micro-machining of silicon wafer in air and under water

(2010) L.M. Wee et al.   OPTICS AND LASER TECHNOLOGY

Very large spot size effect in nanosecond laser drilling efficiency of silicon

(2010) Fernando Brandi et al.   OPTICS EXPRESS

Theoretical approach to estimate laser process parameters for drilling in crystalline silicon

(2010) T. Baier et al.   PROGRESS IN PHOTOVOLTAICS