Multi-Strata Stealth Dicing Before Grinding for Singulation-Defects Elimination and Die Strength Enhancement: Experiment and Simulation

Published 2015 View Full Article

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Title
Multi-Strata Stealth Dicing Before Grinding for Singulation-Defects Elimination and Die Strength Enhancement: Experiment and Simulation
Authors
Keywords
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Journal
IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING
Volume 28, Issue 3, Pages 408-423
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Online
2015-06-02
DOI
10.1109/tsm.2015.2438875

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