The unbiased propagation mechanism in laser cutting silicon wafer with laser induced thermal-crack propagation

Laser cutting sandwich structure glass–silicon–glass wafer with laser induced thermal–crack propagation

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Dual laser beam revising the separation path technology of laser induced thermal-crack propagation for asymmetric linear cutting glass

(2016) Chunyang Zhao et al.   INTERNATIONAL JOURNAL OF MACHINE TOOLS & MANUFACTURE

Laser cutting silicon-glass double layer wafer with laser induced thermal-crack propagation

(2016) Yecheng Cai et al.   OPTICS AND LASERS IN ENGINEERING

Ultrathin Wafer Pre-Assembly and Assembly Process Technologies: A Review

(2015) Michael Raj Marks et al.   CRITICAL REVIEWS IN SOLID STATE AND MATERIALS SCIENCES

Modeling of Mechanical Influence of Double-Beam Laser on Single-Crystalline Silicon

(2014) S.V. Shalupaev et al.   ARCHIVES OF METALLURGY AND MATERIALS

Semiconductor laser asymmetry cutting glass with laser induced thermal-crack propagation

(2014) Chunyang Zhao et al.   OPTICS AND LASERS IN ENGINEERING

Laser Dicing of Silicon:Comparison of Ablation Mechanisms with a Novel Technology of Thermally Induced Stress

(2010) Oliver Haupt   Journal of Laser Micro Nanoengineering

Laser singulation of thin wafer: Die strength and surface roughness analysis of 80μm silicon dice

(2009) Nitin Sudani et al.   OPTICS AND LASERS IN ENGINEERING

Grinding of silicon wafers: A review from historical perspectives

(2008) Z.J. Pei et al.   INTERNATIONAL JOURNAL OF MACHINE TOOLS & MANUFACTURE