Ultrashort pulse laser dicing of thin Si wafers: the influence of laser-induced periodic surface structures on the backside breaking strength

Published 2016 View Full Article

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Title
Ultrashort pulse laser dicing of thin Si wafers: the influence of laser-induced periodic surface structures on the backside breaking strength
Authors
Keywords
-
Journal
JOURNAL OF MICROMECHANICS AND MICROENGINEERING
Volume 26, Issue 11, Pages 115004
Publisher
IOP Publishing
Online
2016-09-29
DOI
10.1088/0960-1317/26/11/115004

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