Consideration of temperature and current stress testing on flip chip solder interconnects

Published 2008 View Full Article

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Title
Consideration of temperature and current stress testing on flip chip solder interconnects
Authors
Keywords
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Journal
MICROELECTRONICS RELIABILITY
Volume 48, Issue 11-12, Pages 1847-1856
Publisher
Elsevier BV
Online
2008-09-17
DOI
10.1016/j.microrel.2008.07.070

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