Electromigration and thermomigration behavior of flip chip solder joints in high current density packages

Published 2008 View Full Article

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Title
Electromigration and thermomigration behavior of flip chip solder joints in high current density packages
Authors
Keywords
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Journal
JOURNAL OF MATERIALS RESEARCH
Volume 23, Issue 09, Pages 2333-2339
Publisher
Cambridge University Press (CUP)
Online
2008-08-29
DOI
10.1557/jmr.2008.0305

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