Electromigration effect on pancake type void propagation near the interface of bulk solder and intermetallic compound

Published 2009 View Full Article

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Title
Electromigration effect on pancake type void propagation near the interface of bulk solder and intermetallic compound
Authors
Keywords
-
Journal
JOURNAL OF APPLIED PHYSICS
Volume 105, Issue 6, Pages 063710
Publisher
AIP Publishing
Online
2009-03-20
DOI
10.1063/1.3088946
References
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