Thermomigration in Pb-free SnAg solder joint under alternating current stressing

Published 2009 View Full Article

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Title
Thermomigration in Pb-free SnAg solder joint under alternating current stressing
Authors
Keywords
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Journal
APPLIED PHYSICS LETTERS
Volume 94, Issue 9, Pages 092107
Publisher
AIP Publishing
Online
2009-03-05
DOI
10.1063/1.3089872
References
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