Direct measurement of hot-spot temperature in flip-chip solder joints under current stressing using infrared microscopy

Published 2008 View Full Article

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Title
Direct measurement of hot-spot temperature in flip-chip solder joints under current stressing using infrared microscopy
Authors
Keywords
-
Journal
JOURNAL OF APPLIED PHYSICS
Volume 104, Issue 3, Pages 033708
Publisher
AIP Publishing
Online
2008-08-07
DOI
10.1063/1.2949279

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