Electromigration behavior of lead-free solder flip chip bumps on NiP/Cu metallization

Title
Electromigration behavior of lead-free solder flip chip bumps on NiP/Cu metallization
Authors
Keywords
-
Journal
JOURNAL OF APPLIED PHYSICS
Volume 103, Issue 12, Pages 123506
Publisher
AIP Publishing
Online
2008-06-17
DOI
10.1063/1.2940133

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