Surface modification on plating-based Cu/Sn/0.7Cu lead-free copper pillars by using polishing

Published 2008 View Full Article

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Title
Surface modification on plating-based Cu/Sn/0.7Cu lead-free copper pillars by using polishing
Authors
Keywords
-
Journal
MICROELECTRONIC ENGINEERING
Volume 85, Issue 7, Pages 1590-1596
Publisher
Elsevier BV
Online
2008-03-24
DOI
10.1016/j.mee.2008.03.005

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