The Influence of an Imposed Current on the Creep of Sn-Ag-Cu Solder

Published 2008 View Full Article

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Title
The Influence of an Imposed Current on the Creep of Sn-Ag-Cu Solder
Authors
Keywords
-
Journal
JOURNAL OF ELECTRONIC MATERIALS
Volume 38, Issue 2, Pages 221-226
Publisher
Springer Nature
Online
2008-10-11
DOI
10.1007/s11664-008-0568-3

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