Failure induced by thermomigration of interstitial Cu in Pb-free flip chip solder joints

Published 2008 View Full Article

  1. Home
  2. Publications
  3. Publication Search
  4. Publication Details
Title
Failure induced by thermomigration of interstitial Cu in Pb-free flip chip solder joints
Authors
Keywords
-
Journal
APPLIED PHYSICS LETTERS
Volume 93, Issue 12, Pages 122103
Publisher
AIP Publishing
Online
2008-09-24
DOI
10.1063/1.2990047

Ask authors/readers for more resources

Protocol

Community support

Reagent

Community support

Reprint

Contact the author

Become a Peeref-certified reviewer

The Peeref Institute provides free reviewer training that teaches the core competencies of the academic peer review process.

Get Started

Ask a Question. Answer a Question.

Quickly pose questions to the entire community. Debate answers and get clarity on the most important issues facing researchers.

Get Started
Webinars Posters Questions Hubs Funding Journals Articles Connect Collections Reviewers About Us FAQs Mobile App Privacy Policy Terms of Use
© Peeref 2019-2024. All rights reserved.