Current Crowding and its Effects on Electromigration and Interfacial Reaction in Lead-Free Solder Joints

Published 2008 View Full Article

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Title
Current Crowding and its Effects on Electromigration and Interfacial Reaction in Lead-Free Solder Joints
Authors
Keywords
-
Journal
JOURNAL OF ELECTRONIC PACKAGING
Volume 130, Issue 3, Pages 031008
Publisher
ASME International
Online
2008-08-13
DOI
10.1115/1.2957322

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