Recent advances on kinetic analysis of electromigration enhanced intermetallic growth and damage formation in Pb-free solder joints

Published 2009 View Full Article

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Title
Recent advances on kinetic analysis of electromigration enhanced intermetallic growth and damage formation in Pb-free solder joints
Authors
Keywords
-
Journal
MICROELECTRONICS RELIABILITY
Volume 49, Issue 3, Pages 253-263
Publisher
Elsevier BV
Online
2009-02-27
DOI
10.1016/j.microrel.2009.01.006

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