Electromigration induced high fraction of compound formation in SnAgCu flip chip solder joints with copper column

Published 2008 View Full Article

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Title
Electromigration induced high fraction of compound formation in SnAgCu flip chip solder joints with copper column
Authors
Keywords
-
Journal
APPLIED PHYSICS LETTERS
Volume 92, Issue 26, Pages 262104
Publisher
AIP Publishing
Online
2008-07-11
DOI
10.1063/1.2953692

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