Electromigration Reliability and Morphologies of Cu Pillar Flip-Chip Solder Joints with Cu Substrate Pad Metallization

Published 2008 View Full Article

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Title
Electromigration Reliability and Morphologies of Cu Pillar Flip-Chip Solder Joints with Cu Substrate Pad Metallization
Authors
Keywords
-
Journal
JOURNAL OF ELECTRONIC MATERIALS
Volume 37, Issue 10, Pages 1624-1630
Publisher
Springer Nature
Online
2008-07-02
DOI
10.1007/s11664-008-0515-3

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