The Impact of Bi Content on the Coarsening Kinetics of IMC Particles and Creep Deformation Under Thermal Cycling
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Title
The Impact of Bi Content on the Coarsening Kinetics of IMC Particles and Creep Deformation Under Thermal Cycling
Authors
Keywords
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Journal
JOURNAL OF ELECTRONIC MATERIALS
Volume -, Issue -, Pages -
Publisher
Springer Science and Business Media LLC
Online
2023-11-07
DOI
10.1007/s11664-023-10780-5
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