Creep Constitutive Models Suitable for Solder Alloys in Electronic Assemblies

Published 2016 View Full Article

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Title
Creep Constitutive Models Suitable for Solder Alloys in Electronic Assemblies
Authors
Keywords
-
Journal
JOURNAL OF ELECTRONIC PACKAGING
Volume 138, Issue 3, Pages 030801
Publisher
ASME International
Online
2016-04-15
DOI
10.1115/1.4033375

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