Interface reaction and intermetallic compound growth behavior of Sn-Ag-Cu lead-free solder joints on different substrates in electronic packaging

Reliability enhancement of Sn-1.0Ag-0.5Cu nano-composite solders by adding multiple sizes of TiO 2 nanoparticles

(2017) Yanni Wen et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Influence of Ce addition on Sn-3.0Ag-0.5Cu solder joints: Thermal behavior, microstructure and mechanical properties

(2017) Xiaoxuan Tu et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Influence of Ag-modified graphene nanosheets addition into Sn–Ag–Cu solders on the formation and growth of intermetallic compound layers

(2017) H.Y. Jing et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Effects of Ag addition on solid–state interfacial reactions between Sn–Ag–Cu solder and Cu substrate

(2017) Ming Yang et al.   MATERIALS CHARACTERIZATION

Lead free Sn-Ag-Cu solders reinforced by Ni-coated graphene nanosheets prepared by mechanical alloying: Microstructural evolution and mechanical durability

(2017) F. Khodabakhshi et al.   MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING

TEM investigation of interfacial microstructure and fracture mode of the Sn-Ag-Cu/Ni joint system

(2017) C.E. Ho et al.   MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING

Effects of Ag content on the interfacial reactions between liquid Sn–Ag–Cu solders and Cu substrates during soldering

(2016) Ming Yang et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Effect of alumina nanoparticles on the microstructure and mechanical durability of meltspun lead-free solders based on tin alloys

(2016) K. Mehrabi et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Microstructures and properties of new Sn–Ag–Cu lead-free solder reinforced with Ni-coated graphene nanosheets

(2016) Guang Chen et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Effect of Yttrium on the Fracture Strength of the Sn-1.0Ag-0.5Cu Solder Joints

(2016) Hyelim Choi et al.   JOURNAL OF ELECTRONIC MATERIALS

Effect of Pr Addition on Properties of Sn-0.5Ag-0.7Cu-0.5Ga Lead-Free Solder

(2016) Nan Xujing et al.   JOURNAL OF ELECTRONIC MATERIALS

Improving shear strength of Sn-3.0Ag-0.5Cu/Cu joints and suppressing intermetallic compounds layer growth by adding graphene nanosheets

(2016) Yilong Huang et al.   MATERIALS LETTERS

Design and performance of Ag nanoparticle-modified graphene/SnAgCu lead-free solders

(2016) Lianyong Xu et al.   MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING

Effect of nano-Al2O3 reinforcement on the microstructure and reliability of Sn–3.0Ag–0.5Cu solder joints

(2016) Zhenyu Zhao et al.   MICROELECTRONICS RELIABILITY

Development of new multicomponent Sn–Ag–Cu–Bi lead-free solders for low-cost commercial electronic assembly

(2015) A.A. El-Daly et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Effects of Ga addition on microstructure and properties of Sn–Ag–Cu/Cu solder joints

(2015) Q.K. Zhang et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Microstructural modifications and properties of low-Ag-content Sn–Ag–Cu solder joints induced by Zn alloying

(2015) A.A. El-Daly et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Effects of graphene nanosheets on interfacial reaction of Sn–Ag–Cu solder joints

(2015) Lianyong Xu et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Interfacial reactions between Cu and SnAgCu solder doped with minor Ni

(2015) Hsi-Kuei Cheng et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Interfacial compounds growth of SnAgCu(nano La 2 O 3 )/Cu solder joints based on experiments and FEM

(2015) Liang Zhang et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Effect of nano-Fe2O3 additions on wettability and interfacial intermetallic growth of low-Ag content Sn–Ag–Cu solders on Cu substrates

(2015) Yue Gu et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Effects of Fe2NiO4 nanoparticles addition into lead free Sn–3.0Ag–0.5Cu solder pastes on microstructure and mechanical properties after reflow soldering process

(2015) Srivalli Chellvarajoo et al.   MATERIALS & DESIGN

Influence of nanoparticle addition on the formation and growth of intermetallic compounds (IMCs) in Cu/Sn–Ag–Cu/Cu solder joint during different thermal conditions

(2015) Ai Ting Tan et al.   SCIENCE AND TECHNOLOGY OF ADVANCED MATERIALS

Influence of La2O3 nanoparticle additions on microstructure, wetting, and tensile characteristics of Sn–Ag–Cu alloy

(2015) Ashutosh Sharma et al.   MATERIALS & DESIGN

Properties enhancement of low Ag-content Sn–Ag–Cu lead-free solders containing small amount of Zn

(2014) A.A. El-Daly et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Effects of indium addition on properties and wettability of Sn–0.7Cu–0.2Ni lead-free solders

(2014) L.F. Li et al.   MATERIALS & DESIGN

Properties enhancement of SnAgCu solders containing rare earth Yb

(2014) Liang Zhang et al.   MATERIALS & DESIGN

Influence of Zn addition on the microstructure, melt properties and creep behavior of low Ag-content Sn–Ag–Cu lead-free solders

(2014) A.A. El-Daly et al.   MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING

Growth mechanism of intermetallic compounds and damping properties of Sn–Ag–Cu-1wt% nano-ZrO2 composite solders

(2014) Asit Kumar Gain et al.   MICROELECTRONICS RELIABILITY

Texture evolution and its effects on growth of intermetallic compounds formed at eutectic Sn37Pb/Cu interface during solid-state aging

(2012) Ming Yang et al.   INTERMETALLICS

Influence of Ni nanoparticle on the morphology and growth of interfacial intermetallic compounds between Sn–3.8Ag–0.7Cu lead-free solder and copper substrate

(2012) S.L. Tay et al.   INTERMETALLICS

Effect of trace Al on growth rates of intermetallic compound layers between Sn-based solders and Cu substrate

(2012) J.F. Li et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Influence of TiO2 nanoparticles on IMC growth in Sn–3.0Ag–0.5Cu–xTiO2 solder joints in reflow process

(2012) Y. Tang et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Properties and interfacial microstructure of Sn–Zn–Ga solder joint with rare earth Pr addition

(2012) Huan Ye et al.   MATERIALS & DESIGN

Effect of graphene nanosheets reinforcement on the performance of SnAgCu lead-free solder

(2012) X.D. Liu et al.   MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING

Kinetics of intermetallic phase formation at the interface of Sn–Ag–Cu–X (X=Bi, In) solders with Cu substrate

(2011) Erika Hodúlová et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Suppressing effect of 0.5wt.% nano-TiO2 addition into Sn–3.5Ag–0.5Cu solder alloy on the intermetallic growth with Cu substrate during isothermal aging

(2011) L.C. Tsao   JOURNAL OF ALLOYS AND COMPOUNDS

Intermetallic compound growth suppression at high temperature in SAC solders with Zn addition on Cu and Ni–P substrates

(2011) H.R. Kotadia et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Interface reaction between SnAgCu/SnAgCuCe solders and Cu substrate subjected to thermal cycling and isothermal aging

(2011) Liang Zhang et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Reaction of Liquid Sn-Ag-Cu-Ce Solders with Solid Copper

(2011) J. Chriaštel’ová et al.   JOURNAL OF ELECTRONIC MATERIALS

Stability of molybdenum nanoparticles in Sn–3.8Ag–0.7Cu solder during multiple reflow and their influence on interfacial intermetallic compounds

(2011) A.S.M.A. Haseeb et al.   MATERIALS CHARACTERIZATION

Interfacial reaction and elemental redistribution in Sn3.0Ag0.5Cu–xPd/immersion Au/electroless Ni solder joints after aging

(2011) I-Tai Wang et al.   Materials Science and Engineering B-Advanced Functional Solid-State Materials

Study of interfacial reactions between Sn3.5Ag0.5Cu composite alloys and Cu substrate

(2011) L.C. Tsao et al.   MICROELECTRONIC ENGINEERING

Effect of additions of ZrO2 nano-particles on the microstructure and shear strength of Sn–Ag–Cu solder on Au/Ni metallized Cu pads

(2011) Asit Kumar Gain et al.   MICROELECTRONICS RELIABILITY

Microstructure, thermal analysis and hardness of a Sn–Ag–Cu–1wt% nano-TiO2 composite solder on flexible ball grid array substrates

(2011) Asit Kumar Gain et al.   MICROELECTRONICS RELIABILITY

Effect of Cu concentration, solder volume, and temperature on the reaction between SnAgCu solders and Ni

(2010) S.C. Yang et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Investigation of gap filling ability of Ag–Cu–In brazing filler metals

(2010) L. Sisamouth et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Evolution of nano-Ag3Sn particle formation on Cu–Sn intermetallic compounds of Sn3.5Ag0.5Cu composite solder/Cu during soldering

(2010) L.C. Tsao   JOURNAL OF ALLOYS AND COMPOUNDS

Influence of SrTiO3 nano-particles on the microstructure and shear strength of Sn–Ag–Cu solder on Au/Ni metallized Cu pads

(2010) Tama Fouzder et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Microstructure, kinetic analysis and hardness of Sn–Ag–Cu–1wt% nano-ZrO2 composite solder on OSP-Cu pads

(2010) Asit Kumar Gain et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Reactions of Sn-3.5Ag-Based Solders Containing Zn and Al Additions on Cu and Ni(P) Substrates

(2010) H. R. Kotadia et al.   JOURNAL OF ELECTRONIC MATERIALS

Effects of nano-Al2O3 additions on microstructure development and hardness of Sn3.5Ag0.5Cu solder

(2010) L.C. Tsao et al.   MATERIALS & DESIGN

Effect of indium on the microstructure of the interface between Sn3.13Ag0.74CuIn solder and Cu substrate

(2009) Pavol Šebo et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Evolutions of the interface and shear strength between SnAgCu–xNi solder and Cu substrate during isothermal aging at 150°C

(2009) Ping Liu et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Growth Behavior of Intermetallic Compounds at SnAgCu/Ni and Cu Interfaces

(2009) Lihua Qi et al.   JOURNAL OF MATERIALS ENGINEERING AND PERFORMANCE

Kinetics of intermetallic compound layers and shear strength in Bi-bearing SnAgCu/Cu soldering couples

(2008) Jie Zhao et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Effects of minor Fe, Co, and Ni additions on the reaction between SnAgCu solder and Cu

(2008) Y.W. Wang et al.   JOURNAL OF ALLOYS AND COMPOUNDS

One- and Two-Dimensional Diffusion of Metal Atoms in Graphene

(2008) Yanjie Gan et al.   Small

Effects of small amount addition of rare earth Er on microstructure and property of SnAgCu solder

(2007) Yaowu Shi et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Effects of multiple reflows on intermetallic morphology and shear strength of SnAgCu–xNi composite solder joints on electrolytic Ni/Au metallized substrate

(2007) Pei Yao et al.   JOURNAL OF ALLOYS AND COMPOUNDS