The Impact of Bi Content on the Coarsening Kinetics of IMC Particles and Creep Deformation Under Thermal Cycling

Shear Fatigue Analysis of SAC-Bi Solder Joint Exposed to Varying Stress Cycling Conditions

(2023) Minghong Jian et al.   IEEE Transactions on Components Packaging and Manufacturing Technology

Analysis and Modeling of Aged SAC-Bi Solder Joints Subjected to Varying Stress Cycling Conditions

(2023) Minghong Jian et al.   Materials

Power Law Creep Behavior Model of Third Generation Lead-Free Alloys Considering Isothermal Aging

(2023) Mohamed El Amine Belhadi et al.   JOURNAL OF ELECTRONIC PACKAGING

Fatigue performance and microstructure of lead-free solder joints in BGA assembly at room temperature

(2023) Xin Wei et al.   MICROELECTRONICS RELIABILITY

Effect of Bi content and aging on solder joint shear properties considering strain rate

(2023) Mohamed El Amine Belhadi et al.   MICROELECTRONICS RELIABILITY

Effect of temperature on the low cycle fatigue properties of BGA solder joints

(2023) Xin Wei et al.   MICROELECTRONICS RELIABILITY

Effect of Cu, Ni, Ag addition on creeping properties of Sn5Sb-0.5Cu-0.1Ni-0.5Ag for high temperature packaging

(2022) Bangyao Han et al.   SOLDERING & SURFACE MOUNT TECHNOLOGY

Effects of Bi Addition on the Solderability and Mechanical Properties of Sn-Zn-Cu Lead-Free Solder

(2022) Cunji Pu et al.   JOURNAL OF ELECTRONIC MATERIALS

Shear and Fatigue Properties of Lead-Free Solder Joints: Modeling and Microstructure Analysis

(2022) Xin Wei et al.   JOURNAL OF ELECTRONIC PACKAGING

Effect of electric current stressing on mechanical performance of solders and solder joints: A review

(2022) Bo Wang et al.   JOURNAL OF MATERIALS SCIENCE

The Effect of Micro-Alloying and Surface Finishes on the Thermal Cycling Reliability of Doped SAC Solder Alloys

(2022) Francy John Akkara et al.   Materials

Assessing the SAC305 Solder Joint Fatigue in Ball Grid Array Assembly Using Strain-Controlled and Stress-Controlled Approaches

(2022) Xin Wei et al.   JOURNAL OF ELECTRONIC PACKAGING

Effects of antimony on the microstructure, thermal properties, mechanical performance, and interfacial behavior of Sn–0.7Cu–0.05Ni–xSb/Cu solder joints

(2021) Suchart Chantaramanee et al.   JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS

Effect of Aluminum Addition on the Microstructure and Properties of Non-Eutectic Sn-20Bi Solder Alloys

(2019) Yang et al.   Materials

Effect of Cu concentration on the interfacial reactions between Sn-xCu solders and Cu substrate

(2019) Nifa Bao et al.   Materials Research Express

Effect of addition of Cu on the properties of eutectic Sn-Bi solder alloy

(2019) S.N. Alam et al.   MATERIALS SCIENCE-POLAND

Thermal Preconditioning and Restoration of Bismuth-Containing, Lead-Free Solder Alloys

(2019) André M. Delhaise et al.   JOURNAL OF ELECTRONIC MATERIALS

Improvement in the mechanical properties of eutectic Sn58Bi alloy by 0.5 and 1 wt% Zn addition before and after thermal aging

(2018) Shiqi Zhou et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Effect of Bi Additions on the Creep Behaviour of SAC Solder Alloys

(2018) M. Celikin et al.   JOURNAL OF ELECTRONIC MATERIALS

Interface reaction and intermetallic compound growth behavior of Sn-Ag-Cu lead-free solder joints on different substrates in electronic packaging

(2018) Ming-yue Xiong et al.   JOURNAL OF MATERIALS SCIENCE

Microstructure, IMCs layer and reliability of Sn-58Bi solder joint reinforced by Mo nanoparticles during thermal cycling

(2018) Li Yang et al.   MATERIALS CHARACTERIZATION

Effects of Thermal Cycling on Creep of SnAgCu Solder Joints

(2018) T. Alghoul et al.   IEEE Transactions on Components Packaging and Manufacturing Technology

Effect of Sn-Ag-Cu on the Improvement of Electromigration Behavior in Sn-58Bi Solder Joint

(2017) Fengjiang Wang, Lili Zhou, Zhijie Zhang, Jiheng Wang et al.   JOURNAL OF ELECTRONIC MATERIALS

Creep Constitutive Models Suitable for Solder Alloys in Electronic Assemblies

(2016) Subhasis Mukherjee et al.   JOURNAL OF ELECTRONIC PACKAGING

Microhardness and shear performance of Fe/Bi-bearing SAC105 solder alloys under high temperature aging

(2016) Bakhtiar Ali et al.   JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS

Effect of TiO 2 additions on Sn-0.7Cu-0.05Ni lead-free composite solder

(2016) M.I.I. Ramli et al.   MICROELECTRONICS RELIABILITY

Thermal Fatigue Evaluation of Pb-Free Solder Joints: Results, Lessons Learned, and Future Trends

(2015) Richard J. Coyle et al.   JOM

Effects of Silver and Antimony Content in Lead-Free High-Temperature Solders of Bi-Ag and Bi-Sb on Copper Substrate

(2013) M. Nahavandi et al.   JOURNAL OF ELECTRONIC MATERIALS

Microstructure, Thermal and Wetting Properties of Sn-Bi-Zn Lead-Free Solder

(2013) Xu Chen et al.   JOURNAL OF ELECTRONIC MATERIALS

IMC growth of Sn-3.5Ag/Cu system: Combined chemical reaction and diffusion mechanisms

(2012) Ousama M. Abdelhadi et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Influence of microstructure on quasi-static and dynamic mechanical properties of bismuth-containing lead-free solder alloys

(2011) David B. Witkin   MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING

Effects of surface finishes and loading speeds on shear strength of Sn–3.0Ag–0.5Cu solder joints

(2011) Jae-Myeong Kim et al.   MICROELECTRONIC ENGINEERING

Influence of indium addition on characteristics of Sn–0.3Ag–0.7Cu solder alloy

(2009) Kannachai Kanlayasiri et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Influence of Sn Grain Size and Orientation on the Thermomechanical Response and Reliability of Pb-free Solder Joints

(2008) T.R. Bieler et al.   IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES

Anisotropic Crystal Plasticity Finite Element Modeling of the Effect of Crystal Orientation and Solder Joint Geometry on Deformation after Temperature Change

(2008) A. Zamiri et al.   JOURNAL OF ELECTRONIC MATERIALS

Effect of Cu addition on the microstructure and mechanical properties of AlCoCrFeNiTi0.5 solid-solution alloy

(2007) Y.J. Zhou et al.   JOURNAL OF ALLOYS AND COMPOUNDS