Shear and Fatigue Properties of Lead-Free Solder Joints: Modeling and Microstructure Analysis
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Title
Shear and Fatigue Properties of Lead-Free Solder Joints: Modeling and Microstructure Analysis
Authors
Keywords
-
Journal
JOURNAL OF ELECTRONIC PACKAGING
Volume 145, Issue 2, Pages -
Publisher
ASME International
Online
2022-08-24
DOI
10.1115/1.4055318
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