Microstructure, IMCs layer and reliability of Sn-58Bi solder joint reinforced by Mo nanoparticles during thermal cycling

Published 2018 View Full Article

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Title
Microstructure, IMCs layer and reliability of Sn-58Bi solder joint reinforced by Mo nanoparticles during thermal cycling
Authors
Keywords
Microstructure, IMCs layer, Reliability, Mo nanoparticles, Thermal cycling
Journal
MATERIALS CHARACTERIZATION
Volume 148, Issue -, Pages 280-291
Publisher
Elsevier BV
Online
2018-12-29
DOI
10.1016/j.matchar.2018.12.012

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