Assessing the SAC305 Solder Joint Fatigue in Ball Grid Array Assembly Using Strain-Controlled and Stress-Controlled Approaches

The Effect of Micro-Alloying and Surface Finishes on the Thermal Cycling Reliability of Doped SAC Solder Alloys

(2022) Francy John Akkara et al.   Materials

Fatigue mechanism of medium-carbon steel welded joint: Competitive impacts of various defects

(2021) D.Q.Q. Wang et al.   INTERNATIONAL JOURNAL OF FATIGUE

Fatigue Properties and Microstructure of Snagcu Bi-Based Solder Joint

(2020) Minghong Jian et al.   JOURNAL OF ELECTRONIC PACKAGING

Microstructural evolution during high temperature dwell-fatigue of austenitic stainless steels

(2020) Hugo Wärner et al.   INTERNATIONAL JOURNAL OF FATIGUE

Thermal Shock Reliability of Isothermally Aged Doped Lead-Free Solder With Semiparametric Estimation

(2019) Anto Raj et al.   IEEE Transactions on Components Packaging and Manufacturing Technology

Effects of Surface Finish on the Shear Fatigue of SAC-Based Solder Alloys

(2019) Sinan Su et al.   IEEE Transactions on Components Packaging and Manufacturing Technology

Effect of additional elements on the low-cycle-fatigue characteristics of Sn-1.0Ag-0.7Cu solder obtained using a miniature-sized specimen

(2018) Hideyuki Kanayama et al.   INTERNATIONAL JOURNAL OF FATIGUE

Evaluation of structural design methodologies for predicting mechanical reliability of solder joint of BGA and TSSOP under launch random vibration excitation

(2018) Tae-Yong Park et al.   INTERNATIONAL JOURNAL OF FATIGUE

Effect of Long-Term Room Temperature Aging on the Fatigue Properties of SnAgCu Solder Joint

(2018) Sinan Su et al.   JOURNAL OF ELECTRONIC PACKAGING

Effect of Cycling Amplitude Variations on SnAgCu Solder Joint Fatigue Life

(2018) Sa'd Hamasha et al.   IEEE Transactions on Components Packaging and Manufacturing Technology

Analysis of the BGA solder Sn–3.0Ag–0.5Cu crack interface and a prediction of the fatigue life under tensile stress

(2016) Yilong Chen et al.   INTERNATIONAL JOURNAL OF FATIGUE

Effect of Solder-Joint Geometry on the Low-Cycle Fatigue Behavior of Sn-xAg-0.7Cu

(2016) Hwa-Teng Lee et al.   JOURNAL OF ELECTRONIC MATERIALS

Effects of Strain Rate and Amplitude Variations on Solder Joint Fatigue Life in Isothermal Cycling

(2016) Sa'd Hamasha et al.   JOURNAL OF ELECTRONIC PACKAGING

Thermal Fatigue Evaluation of Pb-Free Solder Joints: Results, Lessons Learned, and Future Trends

(2015) Richard J. Coyle et al.   JOM

Frequency-dependent strain–life characteristics of Sn1.0Ag0.1Cu solder on cupper pad at high cyclic frequency

(2013) E.H. Wong et al.   INTERNATIONAL JOURNAL OF FATIGUE

Fatigue life prediction of solder joints with consideration of frequency, temperature and cracking energy density

(2013) J.H. Lee et al.   INTERNATIONAL JOURNAL OF FATIGUE

A thermo-mechanical cohesive zone model for solder joint lifetime prediction

(2012) L. Benabou et al.   INTERNATIONAL JOURNAL OF FATIGUE

A reliability model for SAC solder covering isothermal mechanical cycling and thermal cycling conditions

(2009) Dominik Herkommer et al.   MICROELECTRONICS RELIABILITY