Effect of Cu, Ni, Ag addition on creeping properties of Sn5Sb-0.5Cu-0.1Ni-0.5Ag for high temperature packaging

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Structure and properties of lead-free solders bearing micro and nano particles

(2014) Liang Zhang et al.   MATERIALS SCIENCE & ENGINEERING R-REPORTS

Investigation of microstructure and mechanical properties of novel Sn–0.5Ag–0.7Cu solders containing small amount of Ni

(2013) A.E. Hammad   MATERIALS & DESIGN

Creep and Mechanical Properties of Cu6Sn5 and (Cu,Ni)6Sn5 at Elevated Temperatures

(2012) Dekui Mu et al.   JOURNAL OF ELECTRONIC MATERIALS

Microstructural evolution and tensile properties of Sn–5Sb solder alloy containing small amount of Ag and Cu

(2011) A.A. El-Daly et al.   JOURNAL OF ALLOYS AND COMPOUNDS

The Effect of Sb Addition on Sn-Based Alloys for High-Temperature Lead-Free Solders: an Investigation of the Ag-Sb-Sn System

(2011) D. Li et al.   JOURNAL OF ELECTRONIC MATERIALS

Microstructure and tensile behavior of Sn–5Sb lead-free solder alloy containing Bi and Cu

(2011) M.J. Esfandyarpour et al.   MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING

Effects of Nano-TiO2 additions on thermal analysis, microstructure and tensile properties of Sn3.5Ag0.25Cu solder

(2009) L.C. Tsao et al.   MATERIALS & DESIGN

Creep damage study at powercycling of lead-free surface mount device

(2008) Pradeep Hegde et al.   COMPUTATIONAL MATERIALS SCIENCE