Effects of Bi Addition on the Solderability and Mechanical Properties of Sn-Zn-Cu Lead-Free Solder

Effect of Cu Content on Performance of Sn-Zn-Cu Lead-Free Solder Alloys Designed by Cluster-Plus-Glue-Atom Model

(2021) Jialong Qiu et al.   Materials

Effects of high static magnetic field on the microstructure of Zn-Bi monotectic alloys during directional solidification process

(2021) Bangfei Zhou et al.   JOURNAL OF ALLOYS AND COMPOUNDS

A novel technology in microstructure design and production of environment-friendly Cu–Bi bearing alloy with guidance of CALPHAD in order to replace toxic Cu–Pb bearing alloy

(2021) Bowen Dong et al.   Journal of Materials Research and Technology-JMR&T

On the mechanism of Sn tunnelling induced intermetallic formation between Sn-8Zn-3Bi solder alloys and Cu substrates

(2019) Guang Ren et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Cu–Ni–Sn–Si alloys designed by cluster-plus-glue-atom model

(2019) Q.X. Yu et al.   MATERIALS & DESIGN

Effect of Bismuth Addition on Physical Properties of Sn-Zn Lead-Free Solder Alloy

(2019) Athil Al-Ezzi et al.   JOURNAL OF ELECTRONIC MATERIALS

Performance of GH4169 brazed joint using a new designed nickel-based filler metal via cluster-plus-glue-atom model

(2019) Honggang Dong et al.   JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY

Effects of Ag contents in Sn–xAg lead-free solders on microstructure, corrosion behavior and interfacial reaction with Cu substrate

(2019) Phacharaphon TUNTHAWIROON et al.   TRANSACTIONS OF NONFERROUS METALS SOCIETY OF CHINA

Density, Surface Tension, and Viscosity of Liquid Pb–Sb Alloys

(2018) Tomasz Gancarz et al.   JOURNAL OF CHEMICAL AND ENGINEERING DATA

Effect of Bi on the microstructure and mechanical properties of Sn-Zn alloys processed by rolling

(2018) Guangyu Liu et al.   MATERIALS CHARACTERIZATION

Density, surface tension and viscosity of Sn-Zn alloys with Ag, Bi, Ga and Na additions

(2017) Tomasz Gancarz   FLUID PHASE EQUILIBRIA

The effects of antimony additions on microstructures, thermal and mechanical properties of Sn-8Zn-3Bi alloys

(2017) Guang Ren et al.   MATERIALS & DESIGN

Alloying influences on low melt temperature SnZn and SnBi solder alloys for electronic interconnections

(2016) Guang Ren et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Microstructure and mechanical properties of Sn-rich Au-Sn solders designed using cluster-plus-glue-atom model

(2016) M.L. Huang et al.   MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING

Ta/Zr-Alloyed V–Cr–Ti Alloys via a Cluster-Plus-Glue-Atom Model for BCC Solid Solutions

(2016) C. Pang et al.   TRANSACTIONS OF THE INDIAN INSTITUTE OF METALS

Thermal property, wettability and interfacial characterization of novel Sn–Zn–Bi–In alloys as low-temperature lead-free solders

(2015) Jian-Chun Liu et al.   MATERIALS & DESIGN

Structure and properties of lead-free solders bearing micro and nano particles

(2014) Liang Zhang et al.   MATERIALS SCIENCE & ENGINEERING R-REPORTS

Microstructures and properties of SnZn-xEr lead-free solders

(2012) Liang ZHANG et al.   JOURNAL OF RARE EARTHS

Highly corrosion-resistant Cu70(Ni,Fe,Mn,Cr)30 cupronickel designed using a cluster model for stable solid solutions

(2010) Jie Zhang et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Pb-free solder-alloy based on Sn–Zn–Bi with the addition of germanium

(2010) Shuo-Hong Wang et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Effect of Bi addition on the activation energy for the growth of Cu5Zn8 intermetallic in the Sn–Zn lead-free solder

(2009) Ramani Mayappan et al.   INTERMETALLICS

Effects of Nano-TiO2 additions on thermal analysis, microstructure and tensile properties of Sn3.5Ag0.25Cu solder

(2009) L.C. Tsao et al.   MATERIALS & DESIGN

Effect of small Sn–3.5Ag–0.5Cu additions on the structure and properties of Sn–9Zn solder in ball grid array packages

(2009) Asit Kumar Gain et al.   MICROELECTRONIC ENGINEERING

Thermodynamic properties and phase equilibria of Sn–Bi–Zn ternary alloys

(2008) Ching-feng Yang et al.   MATERIALS CHEMISTRY AND PHYSICS