Fatigue performance and microstructure of lead-free solder joints in BGA assembly at room temperature
Published 2023 View Full Article
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Title
Fatigue performance and microstructure of lead-free solder joints in BGA assembly at room temperature
Authors
Keywords
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Journal
MICROELECTRONICS RELIABILITY
Volume 149, Issue -, Pages 115217
Publisher
Elsevier BV
Online
2023-08-31
DOI
10.1016/j.microrel.2023.115217
References
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