Effect of temperature on the low cycle fatigue properties of BGA solder joints

Title
Effect of temperature on the low cycle fatigue properties of BGA solder joints
Authors
Keywords
-
Journal
MICROELECTRONICS RELIABILITY
Volume 146, Issue -, Pages 115031
Publisher
Elsevier BV
Online
2023-05-31
DOI
10.1016/j.microrel.2023.115031

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