Power Law Creep Behavior Model of Third Generation Lead-Free Alloys Considering Isothermal Aging

Shear Fatigue Analysis of SAC-Bi Solder Joint Exposed to Varying Stress Cycling Conditions

(2023) Minghong Jian et al.   IEEE Transactions on Components Packaging and Manufacturing Technology

Analysis and Modeling of Aged SAC-Bi Solder Joints Subjected to Varying Stress Cycling Conditions

(2023) Minghong Jian et al.   Materials

Failure Mechanisms Driven Reliability Models for Power Electronics: A Review

(2022) Okafor Ekene Gabriel et al.   JOURNAL OF ELECTRONIC PACKAGING

The Effect of Micro-Alloying and Surface Finishes on the Thermal Cycling Reliability of Doped SAC Solder Alloys

(2022) Francy John Akkara et al.   Materials

Assessing the SAC305 Solder Joint Fatigue in Ball Grid Array Assembly Using Strain-Controlled and Stress-Controlled Approaches

(2022) Xin Wei et al.   JOURNAL OF ELECTRONIC PACKAGING

Strength and Isothermal Fatigue Resistance of SnBi/SnAgCu Joints Reflowed at Low Temperatures

(2021) Manu Yadav et al.   JOURNAL OF ELECTRONIC PACKAGING

Effective acquisition of elastoplastic and creep parameters of lead-free solder alloy from high-temperature micro-indentation eliminating the size effect

(2021) Gesheng Xiao et al.   MECHANICS OF MATERIALS

Fatigue Properties and Microstructure of Snagcu Bi-Based Solder Joint

(2020) Minghong Jian et al.   JOURNAL OF ELECTRONIC PACKAGING

Fatigue Life of Sn3.0Ag0.5Cu Solder Alloy Under Combined Cyclic Shear and Constant Tensile/Compressive Loads

(2020) Travis Dale et al.   JOURNAL OF ELECTRONIC PACKAGING

Thermal Shock Reliability of Isothermally Aged Doped Lead-Free Solder With Semiparametric Estimation

(2019) Anto Raj et al.   IEEE Transactions on Components Packaging and Manufacturing Technology

Diffusion Creep of Realistic SnAgCu Solder Joints at Times and Stresses of Relevance to Thermal Fatigue

(2019) T. Alghoul et al.   IEEE Transactions on Components Packaging and Manufacturing Technology

Effect of Long-Term Room Temperature Aging on the Fatigue Properties of SnAgCu Solder Joint

(2018) Sinan Su et al.   JOURNAL OF ELECTRONIC PACKAGING

The effects of precipitation strengthening and solid solution strengthening on strain rate sensitivity of lead-free solders: Review

(2018) Shiqian Liu et al.   MICROELECTRONICS RELIABILITY

Interface reaction and intermetallic compound growth behavior of Sn-Ag-Cu lead-free solder joints on different substrates in electronic packaging

(2018) Ming-yue Xiong et al.   JOURNAL OF MATERIALS SCIENCE

Effects of Thermal Cycling on Creep of SnAgCu Solder Joints

(2018) T. Alghoul et al.   IEEE Transactions on Components Packaging and Manufacturing Technology

Nanomechanical characterization of Sn–Ag–Cu/Cu joints—Part 1: Young’s modulus, hardness and deformation mechanisms as a function of temperature

(2013) V.M.F. Marques et al.   ACTA MATERIALIA

Nanomechanical characterization of Sn–Ag–Cu/Cu joints—Part 2: Nanoindentation creep and its relationship with uniaxial creep as a function of temperature

(2013) V.M.F. Marques et al.   ACTA MATERIALIA

Thermal analysis and mechanical properties of Sn–1.0Ag–0.5Cu solder alloy after modification with SiC nano-sized particles

(2013) A. A. El-Daly et al.   JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS

IMC growth of Sn-3.5Ag/Cu system: Combined chemical reaction and diffusion mechanisms

(2012) Ousama M. Abdelhadi et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Influence of microstructure on quasi-static and dynamic mechanical properties of bismuth-containing lead-free solder alloys

(2011) David B. Witkin   MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING

Impact of Isothermal Aging on Long-Term Reliability of Fine-Pitch Ball Grid Array Packages with Sn-Ag-Cu Solder Interconnects: Surface Finish Effects

(2010) Tae-Kyu Lee et al.   JOURNAL OF ELECTRONIC MATERIALS

Temperature Dependence of Creep and Hardness of Sn-Ag-Cu Lead-Free Solder

(2009) Y.D. Han et al.   JOURNAL OF ELECTRONIC MATERIALS

A review of mechanical properties of lead-free solders for electronic packaging

(2009) Hongtao Ma et al.   JOURNAL OF MATERIALS SCIENCE

Viscoplastic Parameter Identification for Lead-Free Solder Alloy by Micro-Indentation, FE Simulation and Optimization

(2008) Hiroshi Hamasaki et al.   MATERIALS TRANSACTIONS