Thermal Fatigue Evaluation of Pb-Free Solder Joints: Results, Lessons Learned, and Future Trends

Isothermal Ageing of SnAgCu Solder Alloys: Three-Dimensional Morphometry Analysis of Microstructural Evolution and Its Effects on Mechanical Response

(2014) Milad Maleki et al.   JOURNAL OF ELECTRONIC MATERIALS

Nucleation rates of Sn in undercooled Sn-Ag-Cu flip-chip solder joints

(2013) B. Arfaei et al.   JOURNAL OF APPLIED PHYSICS

Evolution of Ag3Sn at Sn–3.0Ag–0.3Cu–0.05Cr/Cu joint interfaces during thermal aging

(2011) Fei Lin et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Dependence of Sn Grain Morphology of Sn-Ag-Cu Solder on Solidification Temperature

(2011) B. Arfaei et al.   JOURNAL OF ELECTRONIC MATERIALS

Recrystallization and Precipitate Coarsening in Pb-Free Solder Joints During Thermomechanical Fatigue

(2011) Liang Yin et al.   JOURNAL OF ELECTRONIC MATERIALS

Cyclic twin nucleation in tin-based solder alloys

(2010) L.P. Lehman et al.   ACTA MATERIALIA

The Role of Recrystallization in the Failure of SnAgCu Solder Interconnections Under Thermomechanical Loading

(2010) Toni Tuomas Mattila et al.   IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES

Correlations Between the Microstructure and Fatigue Life of Near-Eutectic Sn-Ag-Cu Pb-Free Solders

(2009) Babak Arfaei et al.   JOURNAL OF ELECTRONIC MATERIALS

Influence of Sn Grain Size and Orientation on the Thermomechanical Response and Reliability of Pb-free Solder Joints

(2008) T.R. Bieler et al.   IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES

Nickel-stabilized hexagonal (Cu,Ni)6Sn5 in Sn–Cu–Ni lead-free solder alloys

(2008) Kazuhiro Nogita et al.   SCRIPTA MATERIALIA