The Effect of Micro-Alloying and Surface Finishes on the Thermal Cycling Reliability of Doped SAC Solder Alloys

Shear and Fatigue Properties of Lead-Free Solder Joints: Modeling and Microstructure Analysis

(2022) Xin Wei et al.   JOURNAL OF ELECTRONIC PACKAGING

Microstructure and properties of Sn-Ag and Sn-Sb lead-free solders in electronics packaging: a review

(2021) Xi Wang et al.   JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS

Effects of Surface Finish on the Shear Fatigue of SAC-Based Solder Alloys

(2019) Sinan Su et al.   IEEE Transactions on Components Packaging and Manufacturing Technology

Effect of Long-Term Room Temperature Aging on the Fatigue Properties of SnAgCu Solder Joint

(2018) Sinan Su et al.   JOURNAL OF ELECTRONIC PACKAGING

Interface reaction and intermetallic compound growth behavior of Sn-Ag-Cu lead-free solder joints on different substrates in electronic packaging

(2018) Ming-yue Xiong et al.   JOURNAL OF MATERIALS SCIENCE

A review of lead-free solders for electronics applications

(2017) Shunfeng Cheng et al.   MICROELECTRONICS RELIABILITY

Development of Optical Fiber-Based Daylighting System and Its Comparison

(2015) Irfan Ullah et al.   Energies

Thermal Fatigue Evaluation of Pb-Free Solder Joints: Results, Lessons Learned, and Future Trends

(2015) Richard J. Coyle et al.   JOM

Surface finish effect on reliability of SAC 305 soldered chip resistors

(2013) Maurice N. Collins et al.   SOLDERING & SURFACE MOUNT TECHNOLOGY

Thermal Aging Effects on the Thermal Cycling Reliability of Lead-Free Fine Pitch Packages

(2013) Jiawei Zhang et al.   IEEE Transactions on Components Packaging and Manufacturing Technology

Finite element analysis of the effect of silver content for Sn–Ag–Cu alloy compositions on thermal cycling reliability of solder die attach

(2012) Kenny C. Otiaba et al.   ENGINEERING FAILURE ANALYSIS

Impact of Isothermal Aging on the Long-Term Reliability of Fine-Pitch Ball Grid Array Packages With Different Sn-Ag-Cu Solder Joints

(2012) Jiawei Zhang et al.   IEEE Transactions on Components Packaging and Manufacturing Technology

Recent advances on Sn–Cu solders with alloying elements: review

(2011) Guang Zeng et al.   JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS

Recrystallization behaviour of SnAgCu solder joints

(2007) Janne J. Sundelin et al.   MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING