Analysis and Modeling of Aged SAC-Bi Solder Joints Subjected to Varying Stress Cycling Conditions

Effect of Thermal Aging on the Mechanical Properties of SAC305

(2022) Khozima Hamasha et al.   Materials

Shear and Fatigue Properties of Lead-Free Solder Joints: Modeling and Microstructure Analysis

(2022) Xin Wei et al.   JOURNAL OF ELECTRONIC PACKAGING

The Effect of Micro-Alloying and Surface Finishes on the Thermal Cycling Reliability of Doped SAC Solder Alloys

(2022) Francy John Akkara et al.   Materials

Fatigue Properties and Microstructure of Snagcu Bi-Based Solder Joint

(2020) Minghong Jian et al.   JOURNAL OF ELECTRONIC PACKAGING

Effects of Surface Finish on the Shear Fatigue of SAC-Based Solder Alloys

(2019) Sinan Su et al.   IEEE Transactions on Components Packaging and Manufacturing Technology

Effect of Cycling Amplitude Variations on SnAgCu Solder Joint Fatigue Life

(2018) Sa'd Hamasha et al.   IEEE Transactions on Components Packaging and Manufacturing Technology

Accelerated temperature cycling induced strain and failure behaviour for BGA assemblies of third generation high Ag content Pb-free solder alloys

(2018) Eric Dalton et al.   MATERIALS & DESIGN

Study on Damage Accumulation and Life Prediction with Loads below Fatigue Limit Based on a Modified Nonlinear Model

(2018) Junhong Zhang et al.   Materials

Effects of Strain Rate and Amplitude Variations on Solder Joint Fatigue Life in Isothermal Cycling

(2016) Sa'd Hamasha et al.   JOURNAL OF ELECTRONIC PACKAGING

Correlation Between Solder Joint Fatigue Life and Accumulated Work in Isothermal Cycling

(2015) Sa'd Hamasha et al.   IEEE Transactions on Components Packaging and Manufacturing Technology

Assessment of Solder Joint Fatigue Life Under Realistic Service Conditions

(2014) Sa’d Hamasha et al.   JOURNAL OF ELECTRONIC MATERIALS

Solder joint reliability under realistic service conditions

(2013) P. Borgesen et al.   MICROELECTRONICS RELIABILITY

Microstructure-based modeling of the ageing effect on the deformation behavior of the eutectic micro-constituent in SnAgCu lead-free solder

(2012) Milad Maleki et al.   ACTA MATERIALIA

A Practical Method for Determining the Corten-Dolan Exponent and Its Application to Fatigue Life Prediction

(2012) Shun-Peng Zhu et al.   INTERNATIONAL JOURNAL OF TURBO & JET-ENGINES

A review of mechanical properties of lead-free solders for electronic packaging

(2009) Hongtao Ma et al.   JOURNAL OF MATERIALS SCIENCE