Effect of high temperature high humidity and thermal shock test on interfacial intermetallic compounds (IMCs) growth of low alpha solders

Effects of Sb addition on the properties of Sn-Ag-Cu/(Cu, Ni) solder systems

(2016) Donatella Giuranno et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Synthesis and Properties of Pulse Electrodeposited Lead-Free Tin-Based Sn/ZrSiO4 Nanocomposite Coatings

(2016) Sumit Bhattacharya et al.   METALLURGICAL AND MATERIALS TRANSACTIONS A-PHYSICAL METALLURGY AND MATERIALS SCIENCE

Sn–Ag–Cu nanosolders: Melting behavior and phase diagram prediction in the Sn-rich corner of the ternary system

(2015) Ali Roshanghias et al.   CALPHAD-COMPUTER COUPLING OF PHASE DIAGRAMS AND THERMOCHEMISTRY

Synthesis and melting behaviour of Bi, Sn and Sn–Bi nanostructured alloy

(2015) F. Frongia et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Extrusion Suppression of TSV Filling Metal by Cu-W Electroplating for Three-Dimensional Microelectronic Packaging

(2015) Myong-Hoon Roh et al.   METALLURGICAL AND MATERIALS TRANSACTIONS A-PHYSICAL METALLURGY AND MATERIALS SCIENCE

Effect of Graphene Nanoplatelets on Wetting, Microstructure, and Tensile Characteristics of Sn-3.0Ag-0.5Cu (SAC) Alloy

(2015) Ashutosh Sharma et al.   METALLURGICAL AND MATERIALS TRANSACTIONS A-PHYSICAL METALLURGY AND MATERIALS SCIENCE

Synthesis and thermodynamics of Ag–Cu nanoparticles

(2015) Simona Delsante et al.   PHYSICAL CHEMISTRY CHEMICAL PHYSICS

Influence of La2O3 nanoparticle additions on microstructure, wetting, and tensile characteristics of Sn–Ag–Cu alloy

(2015) Ashutosh Sharma et al.   MATERIALS & DESIGN

Growth mechanism of intermetallic compounds and damping properties of Sn–Ag–Cu-1wt% nano-ZrO2 composite solders

(2014) Asit Kumar Gain et al.   MICROELECTRONICS RELIABILITY

Development of lead free pulse electrodeposited tin based composite solder coating reinforced with ex situ cerium oxide nanoparticles

(2013) Ashutosh Sharma et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Fabrication of Sn-Ag/CeO2 Electro-Composite Solder by Pulse Electrodeposition

(2013) Ashutosh Sharma et al.   METALLURGICAL AND MATERIALS TRANSACTIONS A-PHYSICAL METALLURGY AND MATERIALS SCIENCE

Analysis of high speed shear characteristics of Sn-Ag-Cu solder joints

(2012) Santosh Kumar et al.   Electronic Materials Letters

Evolution of Intermetallic Compounds between Sn-0.3Ag-0.7Cu Low-silver Lead-free Solder and Cu Substrate during Thermal Aging

(2012) Niwat Mookam et al.   JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY

Suppressing effect of 0.5wt.% nano-TiO2 addition into Sn–3.5Ag–0.5Cu solder alloy on the intermetallic growth with Cu substrate during isothermal aging

(2011) L.C. Tsao   JOURNAL OF ALLOYS AND COMPOUNDS

Tensile properties and wettability of SAC0307 and SAC105 low Ag lead-free solder alloys

(2011) Fangjie Cheng et al.   JOURNAL OF MATERIALS SCIENCE

Effect of processable polyindole and nanostructured domain on the selective sensing of dopamine

(2011) P.C. Pandey et al.   Materials Science & Engineering C-Materials for Biological Applications

Effect of additions of ZrO2 nano-particles on the microstructure and shear strength of Sn–Ag–Cu solder on Au/Ni metallized Cu pads

(2011) Asit Kumar Gain et al.   MICROELECTRONICS RELIABILITY

Microstructure, thermal analysis and hardness of a Sn–Ag–Cu–1wt% nano-TiO2 composite solder on flexible ball grid array substrates

(2011) Asit Kumar Gain et al.   MICROELECTRONICS RELIABILITY

Microstructure, kinetic analysis and hardness of Sn–Ag–Cu–1wt% nano-ZrO2 composite solder on OSP-Cu pads

(2010) Asit Kumar Gain et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Effect of Isothermal Aging and Thermal Cycling on Interfacial IMC Growth and Fracture Behavior of SnAgCu/Cu Joints

(2010) Xiaoyan Li et al.   JOURNAL OF ELECTRONIC MATERIALS

A Reliability Study of Nanoparticles Reinforced Composite Lead-Free Solder

(2010) Si Chen et al.   MATERIALS TRANSACTIONS

Preparation and Thermal Analysis of Sn-Ag Nano Solders

(2010) Tran Thai Bao et al.   MATERIALS TRANSACTIONS

Through-Silicon Via (TSV)

(2009) Makoto Motoyoshi   PROCEEDINGS OF THE IEEE

Design, Fabrication, and Properties of High Damping Metal Matrix Composites—A Review

(2009) Hui Lu et al.   Materials

Effect of SiC Nanoparticle Additions on Microstructure and Microhardness of Sn-Ag-Cu Solder Alloy

(2008) Ping Liu et al.   JOURNAL OF ELECTRONIC MATERIALS

Development of lead-free Sn–0.7Cu/Al2O3nanocomposite solders with superior strength

(2008) X L Zhong et al.   JOURNAL OF PHYSICS D-APPLIED PHYSICS

Effects of isothermal aging and temperature–humidity treatment of substrate on joint reliability of Sn–3.0Ag–0.5Cu/OSP-finished Cu CSP solder joint

(2008) Jeong-Won Yoon et al.   MICROELECTRONICS RELIABILITY

Growth of tin whiskers for lead-free plated leadframe packages in high humid environments and during thermal cycling

(2008) Yoshikuni Nakadaira et al.   MICROELECTRONICS RELIABILITY

Research advances in nano-composite solders

(2008) J. Shen et al.   MICROELECTRONICS RELIABILITY

Single-wall carbon nanotube (SWCNT) functionalized Sn–Ag–Cu lead-free composite solders

(2006) K. Mohan Kumar et al.   JOURNAL OF ALLOYS AND COMPOUNDS