Growth of tin whiskers for lead-free plated leadframe packages in high humid environments and during thermal cycling

Published 2008 View Full Article

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Title
Growth of tin whiskers for lead-free plated leadframe packages in high humid environments and during thermal cycling
Authors
Keywords
-
Journal
MICROELECTRONICS RELIABILITY
Volume 48, Issue 1, Pages 83-104
Publisher
Elsevier BV
Online
2008-04-17
DOI
10.1016/j.microrel.2007.01.091

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