Evolution of Intermetallic Compounds between Sn-0.3Ag-0.7Cu Low-silver Lead-free Solder and Cu Substrate during Thermal Aging

Published 2012 View Full Article

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Title
Evolution of Intermetallic Compounds between Sn-0.3Ag-0.7Cu Low-silver Lead-free Solder and Cu Substrate during Thermal Aging
Authors
Keywords
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Journal
JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY
Volume 28, Issue 1, Pages 53-59
Publisher
Elsevier BV
Online
2012-01-31
DOI
10.1016/s1005-0302(12)60023-1

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