Effect of Isothermal Aging and Thermal Cycling on Interfacial IMC Growth and Fracture Behavior of SnAgCu/Cu Joints

Published 2010 View Full Article

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Title
Effect of Isothermal Aging and Thermal Cycling on Interfacial IMC Growth and Fracture Behavior of SnAgCu/Cu Joints
Authors
Keywords
-
Journal
JOURNAL OF ELECTRONIC MATERIALS
Volume 40, Issue 1, Pages 51-61
Publisher
Springer Nature
Online
2010-11-03
DOI
10.1007/s11664-010-1401-3

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