Effects of isothermal aging and temperature–humidity treatment of substrate on joint reliability of Sn–3.0Ag–0.5Cu/OSP-finished Cu CSP solder joint

Published 2008 View Full Article

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Title
Effects of isothermal aging and temperature–humidity treatment of substrate on joint reliability of Sn–3.0Ag–0.5Cu/OSP-finished Cu CSP solder joint
Authors
Keywords
-
Journal
MICROELECTRONICS RELIABILITY
Volume 48, Issue 11-12, Pages 1864-1874
Publisher
Elsevier BV
Online
2008-09-10
DOI
10.1016/j.microrel.2008.07.065

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