Effects of Sb addition on the properties of Sn-Ag-Cu/(Cu, Ni) solder systems

Published 2016 View Full Article

  1. Home
  2. Publications
  3. Publication Search
  4. Publication Details
Title
Effects of Sb addition on the properties of Sn-Ag-Cu/(Cu, Ni) solder systems
Authors
Keywords
Lead-free solder, SAC187, SAC194Sb, Calorimetry, Wetting, Surfaces and interfaces, Microhardness
Journal
JOURNAL OF ALLOYS AND COMPOUNDS
Volume 689, Issue -, Pages 918-930
Publisher
Elsevier BV
Online
2016-08-07
DOI
10.1016/j.jallcom.2016.08.035

Ask authors/readers for more resources

Protocol

Community support

Reagent

Community support

Reprint

Contact the author

Become a Peeref-certified reviewer

The Peeref Institute provides free reviewer training that teaches the core competencies of the academic peer review process.

Get Started

Ask a Question. Answer a Question.

Quickly pose questions to the entire community. Debate answers and get clarity on the most important issues facing researchers.

Get Started
Webinars Posters Questions Hubs Funding Journals Articles Connect Collections Reviewers About Us FAQs Mobile App Privacy Policy Terms of Use
© Peeref 2019-2024. All rights reserved.