Effect of SiC Nanoparticle Additions on Microstructure and Microhardness of Sn-Ag-Cu Solder Alloy

Published 2008 View Full Article

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Title
Effect of SiC Nanoparticle Additions on Microstructure and Microhardness of Sn-Ag-Cu Solder Alloy
Authors
Keywords
-
Journal
JOURNAL OF ELECTRONIC MATERIALS
Volume 37, Issue 6, Pages 874-879
Publisher
Springer Nature
Online
2008-02-23
DOI
10.1007/s11664-007-0366-3

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