Effect of additions of ZrO2 nano-particles on the microstructure and shear strength of Sn–Ag–Cu solder on Au/Ni metallized Cu pads

Published 2011 View Full Article

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Title
Effect of additions of ZrO2 nano-particles on the microstructure and shear strength of Sn–Ag–Cu solder on Au/Ni metallized Cu pads
Authors
Keywords
-
Journal
MICROELECTRONICS RELIABILITY
Volume 51, Issue 12, Pages 2306-2313
Publisher
Elsevier BV
Online
2011-06-20
DOI
10.1016/j.microrel.2011.03.042

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