Microstructure, thermal analysis and hardness of a Sn–Ag–Cu–1wt% nano-TiO2 composite solder on flexible ball grid array substrates

Published 2011 View Full Article

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Title
Microstructure, thermal analysis and hardness of a Sn–Ag–Cu–1wt% nano-TiO2 composite solder on flexible ball grid array substrates
Authors
Keywords
-
Journal
MICROELECTRONICS RELIABILITY
Volume 51, Issue 5, Pages 975-984
Publisher
Elsevier BV
Online
2011-02-07
DOI
10.1016/j.microrel.2011.01.006

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