Development of lead-free Sn–0.7Cu/Al2O3nanocomposite solders with superior strength

Published 2008 View Full Article

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Title
Development of lead-free Sn–0.7Cu/Al2O3nanocomposite solders with superior strength
Authors
Keywords
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Journal
JOURNAL OF PHYSICS D-APPLIED PHYSICS
Volume 41, Issue 9, Pages 095403
Publisher
IOP Publishing
Online
2008-04-04
DOI
10.1088/0022-3727/41/9/095403
References
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