Sn–Ag–Cu nanosolders: Melting behavior and phase diagram prediction in the Sn-rich corner of the ternary system

Published 2015 View Full Article

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Title
Sn–Ag–Cu nanosolders: Melting behavior and phase diagram prediction in the Sn-rich corner of the ternary system
Authors
Keywords
Nanoparticles, CALPHAD, Lead free solders, Size effect, Melting point depression
Journal
CALPHAD-COMPUTER COUPLING OF PHASE DIAGRAMS AND THERMOCHEMISTRY
Volume 49, Issue -, Pages 101-109
Publisher
Elsevier BV
Online
2015-04-11
DOI
10.1016/j.calphad.2015.04.003

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