Analysis of high speed shear characteristics of Sn-Ag-Cu solder joints

Effect of Shearing Speed on High Speed Shear Properties of Sn1.0Ag0.5Cu Solder Bump on Various UBM’s

(2011) Wang-Gu Lee et al.   Korean Journal of Metals and Materials

Mechanism of the Delayed Growth of Intermetallic Compound at the Interface between Sn-4.0Ag-0.5Cu and Cu-Zn Substrate

(2010) Young Min Kim et al.   Electronic Materials Letters

Failure mechanism of Pb-bearing and Pb-free solder joints under high-speed shear loading

(2010) Jong-Woong Kim et al.   METALS AND MATERIALS INTERNATIONAL

Effect of La addition on the interfacial intermetallics and bonding strengths of Sn–58Bi solder joints with Au/Ni/Cu pads

(2009) Yu-Yun Shiue et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Microstructure evolution in Cu pillar/eutectic SnPb solder system during isothermal annealing

(2009) Byoung-Joon Kim et al.   METALS AND MATERIALS INTERNATIONAL

Study on the behavior characteristics of solder balls for FCBGA package

(2009) Seunghyun Cho et al.   METALS AND MATERIALS INTERNATIONAL

Solder joint reliability in flip chip package with surface treatment of ENIG under thermal shock test

(2009) Sang-Su Ha et al.   METALS AND MATERIALS INTERNATIONAL

Correlation studies for component level ball impact shear test and board level drop test

(2008) E.H. Wong et al.   MICROELECTRONICS RELIABILITY

Fracture morphology and mechanism of IMC in Low-Ag SAC Solder/UBM (Ni(P)-Au) for WLCSP

(2008) F. Sun et al.   MICROELECTRONICS RELIABILITY