Growth mechanism of intermetallic compounds and damping properties of Sn–Ag–Cu-1wt% nano-ZrO2 composite solders

Published 2014 View Full Article

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Title
Growth mechanism of intermetallic compounds and damping properties of Sn–Ag–Cu-1wt% nano-ZrO2 composite solders
Authors
Keywords
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Journal
MICROELECTRONICS RELIABILITY
Volume 54, Issue 5, Pages 945-955
Publisher
Elsevier BV
Online
2014-03-03
DOI
10.1016/j.microrel.2014.01.026

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