Comparative study of solder wettability on aluminum substrate and microstructure-properties of Cu-based component/aluminum laser soldering joint
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Title
Comparative study of solder wettability on aluminum substrate and microstructure-properties of Cu-based component/aluminum laser soldering joint
Authors
Keywords
Al/Cu dissimilar welding, Laser soldering, Surface modification, Microstructure, Mechanical properties
Journal
MATERIALS & DESIGN
Volume -, Issue -, Pages 110485
Publisher
Elsevier BV
Online
2022-02-23
DOI
10.1016/j.matdes.2022.110485
References
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