Formation and growth of intermetallic compound layers at the interface during laser soldering using Sn–Ag Cu solder on a Cu Pad

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Title
Formation and growth of intermetallic compound layers at the interface during laser soldering using Sn–Ag Cu solder on a Cu Pad
Authors
Keywords
Lead-free solder, Laser soldering process, Intermetallic compound formation, Impact reliability, Isothermal aging
Journal
JOURNAL OF MATERIALS PROCESSING TECHNOLOGY
Volume 215, Issue -, Pages 6-11
Publisher
Elsevier BV
Online
2014-08-17
DOI
10.1016/j.jmatprotec.2014.08.007

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